The JFS conference and China International Compound Semiconductor Industry Expo will take place from April 9th to 11th, 2024, at the Optical Valley of China Science and Technology Exhibition Center in Wuhan, China. HGTECH will showcase several strategic new products at this event, including fully automated wafer laser annealing intelligent equipment, fully automated wafer laser modification and cutting intelligent equipment, advanced equipment measurement solutions, and a 1.6T high-speed silicon optical module. The exhibition aims to facilitate discussions on cutting-edge industry topics with industry leaders, experts, scholars, and top research institutions.

At the opening ceremony, Xiong Wen, member of the Party Committee and Vice President of HGTECH, delivered a keynote speech titled 'Opportunities and Exploration of Chinese Optoelectronic Enterprises in the Global Landscape of Compound Semiconductors,' exploring innovation trends in compound semiconductor development.

At the exhibition site, HGTECH launched a series of new products for silicon carbide detection, unveiling the 'Lingjing' Aeye series of intelligent equipment. This includes domestically-produced smart equipment for detecting surface defects on silicon carbide substrates and for measuring critical dimensions of silicon carbide wafers. Numerous visitors were attracted and stopped to observe. Wang Li, General Manager of HG Laser Precision Systems Business Group's PCB Microelectronics Business Unit and General Manager of HG Measurement, explained, 'Through independent research and development of stray light suppression image enhancement technology and high-speed imaging technology, and by combining traditional algorithms with AI algorithms, our silicon carbide substrate surface defect detection smart equipment can identify over ten types of normal and abnormal defects. The clarity of defect imaging has improved by 25% compared to traditional methods, and computational capability has increased by 45%. While enhancing imaging quality, we ensure that detection speed remains unaffected, facilitating easier defect identification. We provide process optimization guidance and innovative solutions for domestic silicon carbide substrate manufacturers, advancing the industry's technological capabilities and product quality.'

At the event, HGTECH also exhibited their 1.6T high-speed silicon optical module featuring their proprietary silicon photonics chip, along with the 800G LPO optical module products, and the industry's first 800G ZR/ZR+ Pro optical module. This marks their first official debut in China following their global premiere at the 2024 Optical Fiber Communication Conference and Exhibition (OFC) in the United States in March. The newly launched 1.6T high-speed silicon photonics module utilizes their self-developed single-wave 200G silicon photonics chip. It is compatible with thin film lithium niobate modulators and quantum dot lasers, having 8 parallel transmit and receive channels. The energy consumption of this module is expected to be reduced by 40% compared to traditional one.

On April 10th, at the Compound Semiconductor Core Equipment Parallel Forum, Huang Wei, Director of the Semiconductor Panel Division, HG Laser Precision Systems Business Group, presented on the 'Application of Laser Micromachining Technology in Silicon Carbide Materials.' He participated in discussions with attendees and answered questions live at the event.